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Please be advised that we are joining the nation in showing our respect to such a wonderful Monarch who dedicated 70 years of loyal and dutiful service to the UK and the Commonwealth. Enrgtech will therefore be closed on Monday 19th September for Her Majesty Queen Elizabeth ll's State Funeral.
Fischer Elektronik
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SK452-37,5SA, Fischer Elektronik

SK452-37,5SA, Fischer Elektronik

Flatback 29mm Wide x 25mm High Note Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Note Thermal resistance quoted is with fins vertical in free air
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New items
SK454 -50SA, Fischer Elektronik

SK454 -50SA, Fischer Elektronik

Flatback 21.45mm Wide x 19mm High Note Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Note Thermal resistance quoted is with fins vertical in free air
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New items
SK508-100SA, Fischer Elektronik

SK508-100SA, Fischer Elektronik

Flatback 100mm Wide x 25mm High Note Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Note Thermal resistance quoted is with fins vertical in free air
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New items
ICK PGA 17x17x8, Fischer Elektronik

ICK PGA 17x17x8, Fischer Elektronik

ICK PGA Series Heatsinks for IC processor Black anodised surface Mounting by thermally conductive foil or thermally conductive adhesive PGA Heatsinks
Product Detail
New items
ICK PGA 14x14x14, Fischer Elektronik

ICK PGA 14x14x14, Fischer Elektronik

ICK PGA Series Heatsinks for IC processor Black anodised surface Mounting by thermally conductive foil or thermally conductive adhesive PGA Heatsinks
Product Detail
New items
ICK BGA 27x27x22, Fischer Elektronik

ICK BGA 27x27x22, Fischer Elektronik

Fischer Elektronik ICK BGA Series Heatsink ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included). Features and Benefits Black anodised surface. Heatsink dimensions match respective BGA-type. Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included). BGA Heatsinks
Product Detail
New items
ICK LED R 40x27, Fischer Elektronik

ICK LED R 40x27, Fischer Elektronik

ICK LED R Series High power (HP) and high brightness (HB) LEDs need efficient heat dissipation to facilitate trouble-free functioning, good light yield and long service life. The shape or location of lamps and their housings is often rotationally asymmetric, so that a round body is the appropriate heatsink shape. Fischer has developed ICK LED R and ICK S R (typical SN 674-4832 ) series aluminium heatsinks with dimensions to match the majority of current round housing designs. Black anodised surface Suitable for free or forced convection Heatsink dimensions fitted to respective LED types Simple mounting by using thermally conductive adhesive foil, glue or screw mounting
Product Detail
New items
ICK S 32x32x10, Fischer Elektronik

ICK S 32x32x10, Fischer Elektronik

ICK S Series Square heatsinks for ICs Al-natural surface Mounting by clamp, foil or adhesive PGA Heatsinks
Product Detail
New items
ICK S 32x32x20, Fischer Elektronik

ICK S 32x32x20, Fischer Elektronik

ICK S Series Square heatsinks for ICs Al-natural surface Mounting by clamp, foil or adhesive PGA Heatsinks
Product Detail
New items
ICK PGA 17x17x12, Fischer Elektronik

ICK PGA 17x17x12, Fischer Elektronik

ICK PGA Series Heatsinks for IC processor Black anodised surface Mounting by thermally conductive foil or thermally conductive adhesive PGA Heatsinks
Product Detail
New items
ICK PGA 6x6x14, Fischer Elektronik

ICK PGA 6x6x14, Fischer Elektronik

ICK PGA Series Heatsinks for IC processor Black anodised surface Mounting by thermally conductive foil or thermally conductive adhesive PGA Heatsinks
Product Detail
New items
ICK BGA 14x14x10, Fischer Elektronik

ICK BGA 14x14x10, Fischer Elektronik

Fischer Elektronik ICK BGA Series Heatsink ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included). Features and Benefits Black anodised surface. Heatsink dimensions match respective BGA-type. Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included). BGA Heatsinks
Product Detail
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