SMDLTLFP250T3, Chip Quik Inc.
Product Information
Manufacturer Standard Lead Time:
3 Weeks
Detailed Description:
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
Form:
Jar, 8.8 oz (250g)
Weight:
0.551 lb (249.93g)
Process:
Lead Free
Storage/Refrigeration Temperature:
37°F ~ 46°F (3°C ~ 8°C)
Flux Type:
No-Clean
Other Names:
SMDLTFP250T3
SMDLTFP250T3-ND
Part Status:
Active
Melting Point:
281°F (138°C)
Standard Package:
1
Shelf Life:
6 Months (Date of Manufacture) (Refrigerated)
Shipping Info:
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type:
Solder Paste
Composition:
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Manufacturer:
Chip Quik Inc.
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FAQs
Yes. We ship Chip Quik Inc. SMDLTLFP250T3 Internationally to many countries around the world.
You can order Chip Quik Inc. brand products like Chip Quik Inc. SMDLTLFP250T3 directly through our website or by contacting our Customer Support Team. Or call us at +44 (0) 3303 800 157 or write and email to our support team at sales@enrgtech.co.uk.
Yes. You can also search SMDLTLFP250T3 on website for other similar products.
We accept all major payment methods for all products including ET11295023. Please check your shopping cart at the time of order.
Yes. Our products in Solder category are shipped in lowest possible time.
You will get a confirmation email regarding your order of Chip Quik Inc. SMDLTLFP250T3. You can also check on our website or by contacting our customer support team for further order details on Chip Quik Inc. SMDLTLFP250T3.
We use our internationally recognized delivery partners UPS/DHL. Collection of Chip Quik Inc. SMDLTLFP250T3 can also be arranged by the customer for international shipments by contacting our customer support team. Also you can search on website "Chip Quik Inc." products or by using our unique Enrgtech manufacturing part number ET11295023.
This is manufactured by Chip Quik Inc.. The manufacturer part number is SMDLTLFP250T3. It has typical 3 weeks of manufacturer standard lead time. It features lead free no-clean solder paste bi57.6sn42ag0.4 (57.6/42/0.4) jar, 8.8 oz (250g). The product is designed as a nice jar, 8.8 oz (250g). The typical product's weight is 0.551 lb (249.93g). It is a lead free process. It offers storage features at 37°f ~ 46°f (3°c ~ 8°c). It is a no-clean flux. Alternative Names include smdltfp250t3 smdltfp250t3-nd. Furthermore, the product is active It has a melting point of 281°f (138°c). It is available in the standard package of 1. The product is highly reliable with a long-lasting period of 6 months (date of manufacture) (refrigerated). Shipping Information: ships with cold pack. to ensure customer satisfaction and product integrity, air shipment is recommended.. It comes in solder paste configuration. It is composed of bi57.6sn42ag0.4 (57.6/42/0.4). The chip quik inc.'s product offers user-desired applications.
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