CXDM1002N TR, Central Semiconductor Corp
Product Information
Manufacturer Standard Lead Time:
6 Weeks
Vgs(th) (Max) @ Id:
2.5V @ 250µA
Part Status:
Active
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
TO-243AA
Gate Charge (Qg) (Max) @ Vgs:
6nC @ 5V
Rds On (Max) @ Id, Vgs:
300 mOhm @ 2A, 10V
FET Type:
N-Channel
Standard Package:
1
Manufacturer:
Central Semiconductor Corp
Drain to Source Voltage (Vdss):
100V
Vgs (Max):
20V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Input Capacitance (Ciss) (Max) @ Vds:
550pF @ 25V
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-89
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
2A (Ta)
Power Dissipation (Max):
1.2W (Ta)
Technology:
MOSFET (Metal Oxide)
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This is manufactured by Central Semiconductor Corp. The manufacturer part number is CXDM1002N TR. It has typical 6 weeks of manufacturer standard lead time. The typical Vgs (th) (max) of the product is 2.5v @ 250µa. Furthermore, the product is active The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in [Package/ Case]. The maximum gate charge and given voltages include 6nc @ 5v. It has a maximum Rds On and voltage of 300 mohm @ 2a, 10v. It carries FET type n-channel. It is available in the standard package of 1. The central semiconductor corp's product offers user-desired applications. The product has a 100v drain to source voltage. The maximum Vgs rate is 20v. Its typical moisture sensitivity level is 1 (unlimited). The product's input capacitance at maximum includes 550pf @ 25v. The product is available in surface mount configuration. sot-89 is the supplier device package value. The minimum and maximum Rds On drive voltage includes [Drive Voltage (Max Rds On, Min Rds On)]. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 2a (ta). The product carries maximum power dissipation 1.2w (ta). This product use mosfet (metal oxide) technology.
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