DIL Sockets

New items

LOP-640-S083-95, E-TEC

Super low profile sockets Sockets featuring gold-plated / tin-plated tulip contacts for insertion in standard Ø 0.8 mm PCB holes. Allow PCBs (EPROM) to be fitted on sockets even in applications where the space between two boards is minimal. The memory and its socket have a height above board of only 7.62 mm. Glass fibre reinforced polyester insulation, open frame construction. Juxtaposable sockets without throughput loss. Installation on the board is identical to that for a standard socket, and a track between two contacts is possible.

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New items

POS-318-S001-95 X22, E-TEC

Precision Gold Contacts Precision DIP sockets with gold plated 'tulip' grip contacts & tin plated pins Prevents capilliary action with solder & flux on PCB's Open frame construction maximises heat dissipation Temperature Range: -65°C to +125°C Contacts: Beryllium copper Pins: Brass 100 Cycles (Contact Life) Insulation Resistance: 5 x 109 Ω (at 500Vdc) (Std and hi-Temp); >104 MΩ (at 500Vdc) (FR4 Epoxy)

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New items

3-1571586-2, TE Connectivity

TE Connectivity DIPLOMATE 800 Series Open Frame DIP Socket Connectors DIPLOMATE 800 Series DIP socket connectors with a standard profile,ladder style open frame and 2.54mm centreline. These 800 series PCB through hole mount DIP sockets have gold plated screw machined contacts, UL 94V-0 housings and a 2.67mm height above the PCB.

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New items

2-1571551-1, TE Connectivity

TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Augat 500 Series PCB DIP sockets with stamped and formed contacts in a thermoplastic closed frame insulator. These PCB DIP sockets have a 2.54mm centerline with a 7.62 mm row spacing. The contacts of these PCB DIP IC sockets are gold plated with 4 fingered mating.

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New items

840-AG11D-ESL, TE Connectivity

TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Economy 800 Series Economy 800 series PCB DIP sockets with open ladder style frame and 2.54mm centerline. These PCB DIP IC sockets mount vertically and have stamped and formed gold plated contacts with four fingered mating. Precision four-finger inner contact provides concentric funnel entry for easy flat and round lead insertion "X" and "Y" Stackable Open ladder for cooling, cleaning and inspection Low profile Accommodates rectangular or round IC leads Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362 Beryllium copper inner contact for maximum mechanical and electrical performance

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New items

840-AG11D-ES, TE Connectivity

TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Economy 800 Series Economy 800 series PCB DIP sockets with open ladder style frame and 2.54mm centerline. These PCB DIP IC sockets mount vertically and have stamped and formed gold plated contacts with four fingered mating. Precision four-finger inner contact provides concentric funnel entry for easy flat and round lead insertion "X" and "Y" Stackable Open ladder for cooling, cleaning and inspection Low profile Accommodates rectangular or round IC leads Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362 Beryllium copper inner contact for maximum mechanical and electrical performance

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New items

POS-316-S001-95 X25, E-TEC

Precision Gold Contacts Precision DIP sockets with gold plated 'tulip' grip contacts & tin plated pins Prevents capilliary action with solder & flux on PCB's Open frame construction maximises heat dissipation Temperature Range: -65°C to +125°C Contacts: Beryllium copper Pins: Brass 100 Cycles (Contact Life) Insulation Resistance: 5 x 109 Ω (at 500Vdc) (Std and hi-Temp); >104 MΩ (at 500Vdc) (FR4 Epoxy)

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New items

POS-632-S001-95 X12, E-TEC

Precision Gold Contacts Precision DIP sockets with gold plated 'tulip' grip contacts & tin plated pins Prevents capilliary action with solder & flux on PCB's Open frame construction maximises heat dissipation Temperature Range: -65°C to +125°C Contacts: Beryllium copper Pins: Brass 100 Cycles (Contact Life) Insulation Resistance: 5 x 109 Ω (at 500Vdc) (Std and hi-Temp); >104 MΩ (at 500Vdc) (FR4 Epoxy)

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New items

1571552-4, TE Connectivity

800 Series Open Frame A range of Series 800 Open Frame DIP Economy IC Sockets with Stamped Contacts.

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New items

1437536-2, TE Connectivity

Our large selection of DIP sockets ranging from 6 to 48 contacts provides a highly reliable connection between your integrated circuit (IC) devices and PCBs. Termination options include through hole and surface mounting, four-finger and dual leaf contacts, aswell as a variety of plating options. Applications Industrial controls Intelligent buildings Medical devices Military Other embedded systems Features and Benefits Quick IC mating/unmating Easy field IC replacement Avoidance of IC overheating during soldering Flexibility of system upgrade Large portfolio offers product closest to your need 6 to 48 positions Precision four-finger inner contacts or dual leaf contacts are optional Open frame and closed frame housings End-to-end and side-to-side stackable Available with a variety of plating options

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New items

POS-422-S001-95 X30, E-TEC

Precision Gold Contacts Precision DIP sockets with gold plated 'tulip' grip contacts & tin plated pins Prevents capilliary action with solder & flux on PCB's Open frame construction maximises heat dissipation Temperature Range: -65°C to +125°C Contacts: Beryllium copper Pins: Brass 100 Cycles (Contact Life) Insulation Resistance: 5 x 109 Ω (at 500Vdc) (Std and hi-Temp); >104 MΩ (at 500Vdc) (FR4 Epoxy)

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New items

5-1571552-2, TE Connectivity

TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Economy 800 Series Economy 800 series PCB DIP sockets with open ladder style frame and 2.54mm centerline. These PCB DIP IC sockets mount vertically and have stamped and formed gold plated contacts with four fingered mating. Precision four-finger inner contact provides concentric funnel entry for easy flat and round lead insertion "X" and "Y" Stackable Open ladder for cooling, cleaning and inspection Low profile Accommodates rectangular or round IC leads Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362 Beryllium copper inner contact for maximum mechanical and electrical performance

Product Detail

New Items

LOP-640-S083-95, E-TEC

POS-318-S001-95 X22, E-TEC

3-1571586-2, TE Connectivity

2-1571551-1, TE Connectivity

840-AG11D-ESL, TE Connectivity

840-AG11D-ES, TE Connectivity

POS-316-S001-95 X25, E-TEC

POS-632-S001-95 X12, E-TEC

1571552-4, TE Connectivity

1437536-2, TE Connectivity

POS-422-S001-95 X30, E-TEC

5-1571552-2, TE Connectivity

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