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MCP6V64-E/ST, Microchip Technology

MCP6V64-E-ST Microchip Technology MCP6V64-E/ST
Microchip Technology

Product Information

Manufacturer Standard Lead Time:
6 Weeks
Detailed Description:
Zero-Drift Amplifier 4 Circuit Rail-to-Rail 14-TSSOP
Part Status:
Active
Operating Temperature:
-40°C ~ 125°C
Voltage - Supply, Single/Dual (±):
1.8 V ~ 5.5 V
Package / Case:
14-TSSOP (0.173", 4.40mm Width)
Current - Input Bias:
1pA
Base Part Number:
MCP6V64
Output Type:
Rail-to-Rail
Current - Supply:
80µA
Standard Package:
96
Manufacturer:
Microchip Technology
Current - Output / Channel:
23mA
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Voltage - Input Offset:
8µV
Number of Circuits:
4
Gain Bandwidth Product:
1MHz
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Packaging:
Tube
Slew Rate:
0.45 V/µs
Amplifier Type:
Zero-Drift
RoHs Compliant
Checking for live stock

This is manufactured by Microchip Technology. The manufacturer part number is MCP6V64-E/ST. It has typical 6 weeks of manufacturer standard lead time. It features zero-drift amplifier 4 circuit rail-to-rail 14-tssop. Furthermore, the product is active The product has -40°c ~ 125°c operating temperature range. It features a typical 1.8 v ~ 5.5 v voltage of single or dual. Moreover, the product comes in [Package/ Case]. The typical current - input bias includes 1pa. Base Part Number: mcp6v64. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 80µa. It is available in the standard package of 96. The microchip technology's product offers user-desired applications. It carries 23ma output or channel current. Its typical moisture sensitivity level is 1 (unlimited). The input offset voltage is 8µv. It integrates 4 circuits. The gain bandwidth product is 1mhz. The product is available in surface mount configuration. 14-tssop is the supplier device package value. In addition, tube is the available packaging type of the product. The 0.45 v/µs is the slew rate of the product. It is a sort of a zero-drift amplifier.

pdf icon
Leadframe Material 29/Sep/2017(PCN Assembly/Origin)
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Packing Changes 10/Oct/2016(PCN Packaging)

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