SMDLTLFP250T5, Chip Quik Inc.
Product Information
Manufacturer Standard Lead Time:
3 Weeks
Detailed Description:
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
Melting Point:
281°F (138°C)
Form:
Jar, 8.8 oz (250g)
Process:
Lead Free
Flux Type:
No-Clean
Storage/Refrigeration Temperature:
37°F ~ 46°F (3°C ~ 8°C)
Part Status:
Active
Standard Package:
1
Shelf Life:
6 Months (Date of Manufacture) (Refrigerated)
Shipping Info:
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type:
Solder Paste
Composition:
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Manufacturer:
Chip Quik Inc.
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FAQs
Yes. We ship Chip Quik Inc. SMDLTLFP250T5 Internationally to many countries around the world.
You can order Chip Quik Inc. brand products like Chip Quik Inc. SMDLTLFP250T5 directly through our website or by contacting our Customer Support Team. Or call us at +44 (0) 3303 800 157 or write and email to our support team at sales@enrgtech.co.uk.
Yes. You can also search SMDLTLFP250T5 on website for other similar products.
We accept all major payment methods for all products including ET12098957. Please check your shopping cart at the time of order.
Yes. Our products in Solder category are shipped in lowest possible time.
You will get a confirmation email regarding your order of Chip Quik Inc. SMDLTLFP250T5. You can also check on our website or by contacting our customer support team for further order details on Chip Quik Inc. SMDLTLFP250T5.
We use our internationally recognized delivery partners UPS/DHL. Collection of Chip Quik Inc. SMDLTLFP250T5 can also be arranged by the customer for international shipments by contacting our customer support team. Also you can search on website "Chip Quik Inc." products or by using our unique Enrgtech manufacturing part number ET12098957.
This is manufactured by Chip Quik Inc.. The manufacturer part number is SMDLTLFP250T5. It has typical 3 weeks of manufacturer standard lead time. It features lead free no-clean solder paste bi57.6sn42ag0.4 (57.6/42/0.4) jar, 8.8 oz (250g). It has a melting point of 281°f (138°c). The product is designed as a nice jar, 8.8 oz (250g). It is a lead free process. It is a no-clean flux. It offers storage features at 37°f ~ 46°f (3°c ~ 8°c). Furthermore, the product is active It is available in the standard package of 1. The product is highly reliable with a long-lasting period of 6 months (date of manufacture) (refrigerated). Shipping Information: ships with cold pack. to ensure customer satisfaction and product integrity, air shipment is recommended.. It comes in solder paste configuration. It is composed of bi57.6sn42ag0.4 (57.6/42/0.4). The chip quik inc.'s product offers user-desired applications.
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