SMD291SNL50T3, Chip Quik Inc.
Product Information
Manufacturer Standard Lead Time:
3 Weeks
Detailed Description:
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)
Form:
Jar, 1.76 oz (50g)
Weight:
0.113 lb (51.26g)
Process:
Lead Free
Flux Type:
No-Clean
Storage/Refrigeration Temperature:
37°F ~ 46°F (3°C ~ 8°C)
Part Status:
Active
Melting Point:
423 ~ 428°F (217 ~ 220°C)
Standard Package:
1
Shelf Life:
6 Months (Date of Manufacture) (Refrigerated)
Shipping Info:
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type:
Solder Paste
Composition:
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Manufacturer:
Chip Quik Inc.
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FAQs
Yes. We ship Chip Quik Inc. SMD291SNL50T3 Internationally to many countries around the world.
You can order Chip Quik Inc. brand products like Chip Quik Inc. SMD291SNL50T3 directly through our website or by contacting our Customer Support Team. Or call us at +44 (0) 3303 800 157 or write and email to our support team at sales@enrgtech.co.uk.
Yes. You can also search SMD291SNL50T3 on website for other similar products.
We accept all major payment methods for all products including ET12300683. Please check your shopping cart at the time of order.
Yes. Our products in Solder category are shipped in lowest possible time.
You will get a confirmation email regarding your order of Chip Quik Inc. SMD291SNL50T3. You can also check on our website or by contacting our customer support team for further order details on Chip Quik Inc. SMD291SNL50T3.
We use our internationally recognized delivery partners UPS/DHL. Collection of Chip Quik Inc. SMD291SNL50T3 can also be arranged by the customer for international shipments by contacting our customer support team. Also you can search on website "Chip Quik Inc." products or by using our unique Enrgtech manufacturing part number ET12300683.
This is manufactured by Chip Quik Inc.. The manufacturer part number is SMD291SNL50T3. It has typical 3 weeks of manufacturer standard lead time. It features lead free no-clean solder paste sn96.5ag3cu0.5 (96.5/3/0.5) jar, 1.76 oz (50g). The product is designed as a nice jar, 1.76 oz (50g). The typical product's weight is 0.113 lb (51.26g). It is a lead free process. It is a no-clean flux. It offers storage features at 37°f ~ 46°f (3°c ~ 8°c). Furthermore, the product is active It has a melting point of 423 ~ 428°f (217 ~ 220°c). It is available in the standard package of 1. The product is highly reliable with a long-lasting period of 6 months (date of manufacture) (refrigerated). Shipping Information: ships with cold pack. to ensure customer satisfaction and product integrity, air shipment is recommended.. It comes in solder paste configuration. It is composed of sn96.5ag3cu0.5 (96.5/3/0.5). The chip quik inc.'s product offers user-desired applications.
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